Current Profession

I am a manufacturing engineer. My field is microwave RF hybrid circuit assembly. I am a mixture of a materails, mechanical, and industrial engineer. I figure out how to make thick film micro electronic assemblies. These are combinations of bare chip IC's, passive components such as chip resistors and chip capacitors epoxied with conductive silver epoxy onto typically a ceramic substrate. Sometimes we use PCB materials such as Rogers Duroid or TMM10i in place of the ceramic. The assembled substrates are mounted into aluminum hermetic packages and sealed with a laser sealer.

Sometimes I get involved in SMT surface mount assembly of PCBs. I am actually a Certified Interconnect Designer meaning a PCB designer.

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